Jun Su Lee received the Ph.D. degree in microsystems from Imperial College London in 2006. After PhD, he worked at Amkor Technology Korea as a Senior Researcher to develop electronics packaging. He then worked as a Principal Researcher at the Samsung Electronics for leading a medical X-ray detector development project. Also he developed MEMS packaging as a Scientist II at the Institute of Microelectronics, Singapore.
He is currently working as a Senior Researcher in the Photonics Packaging Group, Tyndall National Institute from 2013. His research activities focus on flip-chip bonding and optical coupling for optoelectronic devices in Si-photonics.
