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Monolithic and Heterogeneous Integration

‘Printed photonics on anything’

The Monolithic and Heterogeneous Integration theme will develop a range of essential semiconductor material, device and integration technologies, with a key objective being to find new ways to combine photonics and electronics together on multiple substrates (silicon, ceramic, polymer etc.) with unprecedented simplicity and cost-effectiveness, using transfer printing. We refer to this colloquially as ‘printed photonics on anything’.

Do you Want to join
The Tyndall IPIC Team

We are seeking best-in-class researchs to join our internationally renowned team