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Packaging and Hybrid Integration

‘Breaking the packaging cost barrier’

The Packaging and Hybrid Integration theme will focus on the high cost of photonic packaging, which can amount to as much as 80% of total product cost in some applications, which has restricted the deployment of photonics to a relatively small number of mass and niche markets to date (albeit markets of enormous value). This Theme will develop optical and electrical wafer-scale assembly and packaging processes and low cost cooling technologies that aim to ‘break this cost barrier’.

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The Tyndall IPIC Team

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