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Chip Scale Review – article

Co-packaging of photonic and electronic ICs on glass interposers – article by IPIC’s Peter O’Brien and Das Kumar.

Flipchip packaging of photonic chip on multi-level glass electrical interposer and alignment of microlens array with integrated micro prisms for out-of-plane coupling.  Read the full article here. Chip-Scale-Review_Mar-Apr_2025-digital

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